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Influence of a Copper Based Stacked Circular Microchannel Heat Sink in the Thermal Enhancement of Electronic Cooling
Abstract
The maximum thermal design power of an Intel i7-8700 K processor is about 80 W to 95 W and the proposed work is applicable for achieving such cooling requirements. Experiments have been conducted to evaluate the heat transfer characteristics and pressure drop in a single layer and double layer circular microchannel heat sink with constant heat flux conditions. De-ionized water is used as the cooling medium. The experiment is carried out by varying Reynolds number from 600 to 5050 with a total constant heat input of 80 W. This paper pursues the study of heat transfer enhancement in flow through a single layer and double layer (parallel flow, and counter flow) arrangements. Heat transfer enhancement is evaluated by the overall effective temperature differences. Results shows the double layer micro channels performed far better than single layer channel in thermal performance. For double layer circular microchannel heat sink, the counter flow arrangements have an obvious advantage over the equivalent parallel flow arrangement with the benefit of temperature uniformity.
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