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Literature Review on Low-Noise Amplifiers for X-Band Applications

Dr. M. Siva Kumar, Barika Vyshnavi, Borra Sirisha, Kommireddygari Navya, Sake Chandra Sekhar

Abstract


In radio frequency (RF) receiver circuits, the effectiveness of the receiver is mostly based on how good the front-end components of the receiver are. One of the components that has a direct effect on the performance of the receiver is the low noise amplifier (LNA). The LNA acts as an amplifier to amplify very small signal strength and adding minimal amounts of noise. Because of its location, right after the antenna, the features of the LNA will affect the sensitivity of the receiver greatly. In this project, the LNA design uses 150 nm gallium nitride (GaN), which has high-frequency performance, high power, and better efficiency than many of the commonly used semiconductors. A good GNSS LNA will not only be high in gain but will have low signal distortion and reduced noise, thereby improving the accuracy of positioning and communication. There are several factors considered when designing modern day LNAs, which include high gain, low noise factor, low power usage, stability, and linearity of the device at the operating frequencies. The analysis of these design factors is essential in helping design high performance LNAs that can help improve RF receiver sensitivity and efficiency.


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References


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Malagonda Siva Kumar and Jayavelu Mohanraj. "Noise coupling reduction using temperature enhanced device for future integrated circuit integration applications." Int J Reconfigurable & Embedded Syst 13, no. 2 (2024): 307-314. DOI: 10.11591/ijres.v13.i2.pp307-314.

Malagonda Siva Kumar and Jayavelu Mohanraj. " Electrical signal interference minimization using appropriate core material for 3D integrate circuit at high frequency applications International Journal of Electrical and Computer Engineering (IJECE) 14, no. 3 (2024): 2500-2507. DOI: 10.11591/ijece.v14i3.pp2500-2507.

Malagonda Siva Kumar and Jayavelu Mohanraj."Modeling and Performance Analysis of TSV using Nanomaterial-Based Dielectric and Core for High Frequency Applications." International Journal of Intelligent Systems and Applications in Engineering 11, no. 3 (2023): 435-441.

M. Siva Kumar, J. Mohanraj, N. Vinodh Kumar, and M. Valliammai. "An extensive survey on future direction for the reduction of noise coupling problem in TSV based 3-dimensional IC integration." Materials Today: Proceedings 46 (2021): 3502-3511. DOI: 10.1016/j.matpr.2020.11.975.

Malagonda Siva Kumar and Jayavelu Mohanraj." Enhancement of Liner Materials Based on Nanomaterials to Promote Sustainability in Noise Intercourse." International Journal of Informatics and Communication Technology (IJ-ICT) ISSN: 2252-8776:Vol 13, No 3 DOI: 10.11591/ijict.v13i3.pp476-483.

Pradyumna Kumar Dhal, Murkur Rajesh, Shaik Hussain Vali, Sadhu Radha Krishna, Malagonda Siva Kumar, Vempalle Rafi." Advancing semiconductor integration: 3D ICs and Perylene-N as superior liner material for minimizing TSV clamour coupling." International Journal of Informatics and Communication Technology (IJ-ICT) ISSN: 2252-8776:Vol 14, No 32 DOI: http://doi.org/10.11591/ijict.v14i2.pp605-613.


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